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High-Order HDI Boards12L
High-Order HDI Boards12L
▪ Layers:12L ▪ Board thickness:0.8mm ▪ Material:EM-370 ▪ Min Width/Spacing:60/60um ▪ Surface treament:ENIG+OSP
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High-Order HDI Boards16L
High-Order HDI Boards16L
▪ Layers -- 16Layer ▪ Material -- PanasonicR-5775 ▪ Thickness --2mm ▪ Inner copper -- HOZ ▪ Min line width/spacing -- 2/2mil ▪ Min Aperture --0.1mm ▪ Surface Treament- ENIG ▪ Application --Communication Equipmet
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High-Order HDI Boards24L
High-Order HDI Boards24L
▪ Layers: 24L▪ Material: FR-4 (Tg180) VT-47▪ Board Thickness: 2.59±0.26 mm▪ Minimum Line Width / Line Space: 3.5 / 5.0 mil▪ Minimum Hole Size: 0.25 mm▪ Surface Finish: Immersion Gold
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High Multilayer Boards10L
High Multilayer Boards10L
▪ Layers: 10L▪ Model: 400Gbps QSFP-DD▪ Material: M6 (R-5775)▪ Finished Thickness Tolerance: 1.0±0.075mm at gold finger area▪ Plug Outline Tolerance: ±0.05mm▪ Hole Fill Dent: ＜15μm▪ Surface Finish: ENEPIG + Hard Electroplated Gold▪ Thermal Design: Embedded Copper Block
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High Multilayer Boards34L
High Multilayer Boards34L
▪ Layers: 34L▪ Material: FR408HR▪ Board Thickness: 4.0mm▪ Inner & Outer Copper Weight: 10oz▪ Surface Finish: ENIG
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High Multilayer Boards26L
High Multilayer Boards26L
▪ Layers: 26L▪ Material: Tachyon 100G▪ Board Thickness: 3.5±0.35 mm▪ Inner Copper Weight: 0.33 oz▪ Min Line Width/Spacing: 0.112/0.05 mm▪ Min Hole Size: 0.225 mm▪ Surface Finish: ENIG▪ Application: Switches
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Heavy Copper Boards10L
Heavy Copper Boards10L
▪ Layers: 10L▪ Material: TU865▪ Board Thickness: 3.5mm▪ Inner & Outer Copper Weight: 5oz▪ Min Line Width / Spacing: 2/2mil▪ Min Hole Size: 0.7mm▪ Surface Finish: ENIG▪ Application: Communication Equipment
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Heavy Copper Boards10L
Heavy Copper Boards10L
▪ Application: Industrial Control System▪ Layers: 10L▪ Material: EM-370(Z)▪ Board Thickness: 2.48mm▪ Inner & Outer Copper Weight: 4oz (RTF)▪ Min Line Width / Spacing: 0.433/0.137mm▪ Min Hole Size: 0.3mm▪ Surface Finish: ENIG
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Heavy Copper Boards10L
Heavy Copper Boards10L
▪ Layers: 10L▪ Material: EM-827▪ Board Thickness: 4.85mm▪ Inner & Outer Copper Weight: 3oz▪ Min Line Width / Spacing: 0.45/0.30mm▪ Min Hole Size: 0.25mm▪ Surface Finish: ENIG
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Rigid-Flex Boards8L
Rigid-Flex Boards8L
▪ Layers: 8L▪ Material: High Tg FR-4 + PI Substrate▪ Board Thickness: 1.0±0.1 mm▪ Min Line Width / Spacing: 0.10/0.10 mm▪ Min Hole Size: 0.1 mm▪ Surface Finish: ENIG
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Rigid-Flex Boards14L
Rigid-Flex Boards14L
▪ Layers: 14L▪ Material: High Tg FR-4 + Flex Material▪ Board Thickness: 1.6±0.16 mm▪ Min Line Width / Spacing: 0.10/0.10 mm▪ Min Hole Size: 0.15 mm▪ Surface Finish: ENIG
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High Speed PCB26L
High Speed PCB26L
▪ Layer count-26L▪ Material -Tachyon 100G▪ Board Thickness --3.5±0.35mm▪ Copper thickness --0.33OZ▪ Min.LW/LS-0.118/0.051mm.Min▪ hole Size --0.225mm▪ Surface Finish --ENIG▪ Application field-Industrial Control
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