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SMT AssemblyIC Test Version
SMT AssemblyIC Test Version
◆ PCB Size: 240mm×200mm◆ Min Component Package for Resistor/Capacitor/Inductor: 0402◆ Min Component Pin Pitch: 0.4mm◆ Soldering Process: Double-sided Reflow Soldering + Wave Soldering◆ Service Flow: PCB Fabrication + Component Sourcing + SMT Assembly
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SMT AssemblyIndustrial Control Board
SMT AssemblyIndustrial Control Board
◆ PCB Size: 200mm×105mm◆ Min RC-L Package: 0402◆ Min Component Pin Pitch: 0.5mm◆ Soldering: Double-sided Reflow + Wave Soldering◆ Process: PCB Fabrication + Component Sourcing + SMT Assembly
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SMT AssemblyCommunication Equipment Motherboard
SMT AssemblyCommunication Equipment Motherboard
◆ PCB Size: 192mm×182mm◆ Min RCL Package: 0201◆ Min Component Pin Pitch: 0.45mm◆ Soldering: Double-sided Reflow + Manual Soldering◆ Process: PCB Fabrication + Component Sourcing + SMT Assembly
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RF Modules4L，1+2+1
RF Modules4L，1+2+1
◆ Structure: 4L，1+2+1，Total thickness:180μm min;◆ Layer alignment: blind via ring width 25μm，Adjacentlayer shift≤25μm，Random layer shift≤40μm◆ MSAP process，trace width tolerance ±5μm ;◆ Surface finish: Thin ENEPIG ( Ni thickness 0.3~0.5μm)
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