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High Speed PCB26L
High Speed PCB26L
▪ Layer count-26L▪ Material -Tachyon 100G▪ Board Thickness --3.5±0.35mm▪ Copper thickness --0.33OZ▪ Min.LW/LS-0.118/0.051mm.Min▪ hole Size --0.225mm▪ Surface Finish --ENIG▪ Application field-Industrial Control
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HF Antenna Boards2L
HF Antenna Boards2L
▪ Layers: 2L▪ Material: Doosan DS-7409DV▪ Board Thickness: 0.6mm ±10%▪ Min Line Width / Spacing: 0.580mm ±5%▪ Min Hole Size: 0.2mm▪ Surface Finish: Immersion Tin
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5G Active Antenna Boards22L
5G Active Antenna Boards22L
▪ Layers: 22L▪ Material: Doosan DS-7409DV HVLP▪ Lamination: 2 times lamination▪ Process: 11 sets of backdrilling tapes, VIPPO▪ Embedded with 22 copper blocks▪ 10 types of impedance (single-ended / differential)▪ High & low voltage electroplated hole filling process
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