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Flip Chip BGA
Flip Chip BGA
Product Model：8L
Product Description：
◆ Layers: 8L (3+2+3 stack-up)
◆ Material: MCL-E-705G + ABF GL102
◆ Board Thickness: 0.76 mm
◆ Size: 50×50 mm
◆ Inner & Outer Copper Thickness: 17 μm
◆ Min Line Width/Spacing: 10/10 μm
◆ Min Hole Size: 50 μm
◆ Surface Finish: Immersion Tin + OSP
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