Why is high-density multi-layer board chosen as the option for high-end electronic devices? What are its technical advantages?

With the rapid development of 5G communication, artificial intelligence, cloud computing, new energy vehicles and smart terminals, the integration degree of electronic devices is getting higher and higher, the data transmission speed is getting faster and faster, and the requirements for PCB circuit boards are also constantly increasing. Under such circumstances, high multi-layer boards, due to their excellent performance and strong carrying capacity, have gradually become an important basic component of high-end electronic devices.

From smart phones to AI servers, from medical equipment to autonomous driving systems, an increasing number of high-performance electronic products are adopting high multi-layer boards. So, why are high multi-layer boards the preferred choice for high-end electronic devices? What are the specific technical advantages they possess?

What is a high multilayer board?

A high multilayer board refers to a multi-layer PCB with a large number of layers, a complex structure, and high processing requirements.

Generally speaking:

PCB above the 10th layer

PCB above the 12th layer

PCB above the 16th layer

It is usually referred to as a high multi-layer board.

Some high-end products even reach:

24th floor

32th floor

Above the 40th floor

Compared with ordinary 4-layer boards and 6-layer boards, high multi-layer boards have more conductive layers and signal layers, enabling more complex circuit designs and higher density of electronic integration within a limited space.

Why are high-end electronic devices increasingly relying on multi-layer boards?

The development trend of electronic products mainly focuses on three directions:

More and more functions

The volume is getting smaller and smaller.

The computing speed is getting faster and faster.

These three directions precisely impose higher requirements on PCBs.

Ordinary multi-layer boards are gradually approaching their limits in terms of wiring capacity, signal integrity and system stability, while high multi-layer boards can effectively address these issues.

Therefore, it has become an important choice for high-end electronic devices.

Technical Advantage 1: Provides more wiring space

High-end electronic products usually integrate a large number of components inside.

For example:

An AI server motherboard may contain:

CPU

GPU

FPGA

High-speed memory

Network switching chip

There is a need for a large number of signal connections between these devices.

If an ordinary PCB is used:

The line capacity will soon be insufficient.

And the high multi-layer board can significantly enhance the wiring capability by increasing the number of conductive layers.

For example:

PCBs of the same size,

The 16-layer board can offer a much higher wiring capacity than the 6-layer board.

This enables the satisfaction of the design requirements for complex systems.

Technical Advantage 2: Enhance Signal Transmission Performance

Modern electronic devices increasingly rely on high-speed data transmission.

For example:

DDR5 memory

PCIe 5.0

PCIe 6.0

USB4

800G optical module

These high-speed interfaces have extremely high requirements for PCB signal integrity.

The high-density multi-layer board can:

Shorten the signal path

Optimize the reflux channel

Reduce crosstalk

Reduce reflection loss

This ensures the stable transmission of high-speed signals.

For servers and communication devices, this is an indispensable capability.

Technical Advantage 3: Better Impedance Control Capability

During high-speed signal transmission:

The discontinuity of impedance is likely to cause:

Signal reflection

Data error

Communication interruption

The high multi-layer board can achieve the following through a reasonable layering design:

50Ω single-ended impedance

90Ω differential impedance

100Ω differential impedance

And keep the error within a relatively small range.

This is for:

Data Center

Network equipment

Communication base station

It is of great significance.

Technical Advantage 4: Enhanced Power Integrity

High-performance chips have increasingly higher requirements for power supply quality.

For example:

When AI chips are in operation, they generate significant transient current fluctuations.

If the power supply system is not designed properly:

容易出现：

Voltage fluctuation

Noise interference

System crashed

High-density multi-layer boards can incorporate dedicated power layers and ground layers.

Form a stable power supply network.

Advantages include:

Reduce power supply noise

Improve power supply stability

Reduce electromagnetic interference

This will thereby enhance the overall system performance.

Technical Advantage 5: Enhancing Electromagnetic Compatibility Performance

As the operating frequency of the equipment continues to increase:

The problem of electromagnetic interference is becoming increasingly prominent.

The high multi-layer board can be used for:

Complete graphic design

Reasonable stacking structure

Power isolation design

Effectively suppress electromagnetic radiation.

At the same time, reduce the impact of external interference on the equipment.

Regarding:

Medical equipment

Communication system

Industrial automation equipment

This advantage is particularly important.

Technical Advantage 6: Support for Higher Integration Design

High-end electronic products generally pursue:

Miniaturization

Lightweighting

Multifunctional

For example:

The interior of a smart phone needs to integrate simultaneously:

Communication module

Video camera system

Storage system

Power Management System

The space is extremely limited.

The high-density multi-layer board can complete complex wiring within a limited area.

Achieve more functional integration.

Therefore, it has become an important choice for high-end consumer electronics.

Technical Advantage 7: Enhancing System Reliability

The high multi-layer board not only focuses on performance.

Emphasizes long-term stable operation.

Through reasonable design:

Can be achieved:

More uniform heat distribution

Greater mechanical strength

Better vibration resistance capability

It is particularly important for the following areas:

Automotive Electronics

Medical equipment

Industrial Control

Aerospace and Aviation

These industries usually require the products to operate continuously for a long period of time.

Reliability is far more important than cost.

What high-end electronic devices mainly use high-density multi-layer boards?

Communication equipment

Including:

5G base station

Optical communication equipment

Core Switch

High-end router

These devices need to handle massive amounts of high-speed data.

The high-density multi-layer board can meet its high-speed transmission requirements.

AI servers and data centers

AI training servers usually require:

Multiple CPUs

Multiple GPUs

High-speed memory system

A large number of high-speed signals require stable transmission.

Therefore, a high multi-layer board design is widely adopted.

New energy vehicles

Applications include:

Autonomous Driving Domain Controller

Intelligent Cockpit System

Battery Management System

Vehicle-mounted communication module

These systems require high-reliability PCB support.

Medical equipment For example:

CT equipment

MRI equipment

Ultrasound diagnostic system

Life monitoring equipment

The high multi-layer board can ensure signal accuracy and system stability.

Industrial automation equipment

Modern industrial control systems are becoming increasingly integrated.

Complex data collection and control tasks need to be handled.

High-density multi-layer boards have become an important hardware foundation.

The future development trend of high multilayer boards

As electronic technology continues to upgrade, high multilayer boards are evolving in the following directions:

Higher levels

Future:

Above the 30th floor

Above the 40th floor

The product will become more widespread.

Higher speed

Support:

PCIe 6.0

PCIe 7.0

224G high-speed transmission

Be designated as a development priority.

Higher integration

Combined with HDI technology.

Realization:

High level of hierarchy

High density

Dual advantages.

Lower-loss materials

Satisfy:

AI Computing

6G Communication

High-performance network equipment

Requirements.